Renesas Electronics · Posted 2 days ago

Staff Package Design Engineer

BengaluruLead

The posting

key requirement, as the employer wrote it

We are looking for a Package Design Engineer to join our advanced silicon packaging design and simulation team and contribute to the design and delivery of high‑performance 2.5D/3D, chiplet‑based, FCBGA, SiP, wire bond and QFP/QFN packages used in industry‑leading products.

The role requires strong technical depth in package layout execution, manufacturability, and cross‑domain co‑design with silicon, SI/PI, thermal, and reliability teams.

Key Responsibilities Perform package layout design and development for advanced packages including 2.5D/3D IC, FCBGA, SiP, and multi‑chip modules.

Develop and maintain package CAD databases, ensuring accuracy and adherence to design guidelines, Design for Manufacturing (DFM), and Design for Assembly (DFA) requirements to ensure producibility.

Manage end-to-end design cycle, including schematic creation, netlist import, footprint assignment, and generation of manufacturing outputs (Gerbers, drill data, fabrication/assembly drawings).

Create and modify substrate/RDL layouts, bump maps, escape routing, and power/ground structures.

Work closely with SI/PI, thermal, reliability, and DFT teams to support co‑design and optimization and participate in design reviews.

Ensure designs comply with foundry, OSAT, and manufacturing design rules (DRC, LVS).

Support ECO cycles, design updates, and version control throughout the project lifecycle.

Minimum Qualifications 6+ years of hands‑on experience in package CAD layout and development.

Strong experience with 2.5D / 3D IC packaging, FCBGA and advanced substrate‑based packages, multi‑die and chiplet‑based designs.

Proficiency in industry‑standard tools such as: Cadence Allegro Package Designer (APD / SiP), Siemens Xpedition / Innovator 3D IC, or equivalent.

Experience working with advanced manufacturing design rules and interface with OSATs.

Good understanding of Signal Integrity (SI) and Power Integrity (PI) fundamentals and High‑Speed Design concepts.

Strong communication, presentation, and documentation skills with the ability to work effectively in a team environment.

Renesas Electronics

Open roles in India
109
Hiring in
Bengaluru, Noida, Hyderabad, Indiranagar, Pune
Applications through
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Counted from the roles we read off Renesas Electronics's own hiring page today.

Renesas Electronics

company

Founded
2010
Headquarters
Tokyo
Employees
21,204
Industry
semiconductor industry
Stock market
Listed on Tokyo Stock Exchange
Company website

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